As an electronics specialist, to be able to deliver a complete solution that spans the full development cycle from design to manufacturing, CAD design is the crucial skill set. Our CAD engineers play a key role in transforming engineering schematics and virtual files into an efficient, realizable, industrial products.
Performing thorough DFM, DFT analyses and making the appropriate edits to ensure manufacturability, testability is also part of the teams scope to ensure smooth ramp up to production and maintain high quality levels over the product lifecycle.
Our team handles CAD work packages as part of larger product design projects for customers and also as a standalone service to our customer's electronics design teams.
An aerospace customer needed us to place and root a complex board. Despite a 2 month delay from the planned start of the project and ongoing design enhancements in the customer’s design, we were asked to do our best to keep the initial delivery date intact. To handle such a challenge, required strong project management and coordination with the customer’s design teams. Finally, we succeeded in completing the project in the required time frame and more importantly demonstrated our commitment to contribute to our customer’s success!
By providing a complete team with CAD engineers supported by a thermal expert for heat sink design, high speed signal expert (hyperlinks simulation) and a mechanical designer; we integrated multiple competencies to provide a full service centered around CAD design of a complex communication board.
In a Design To Cost project, we proposed to our customer during the panel mount activity to root test signals of each paneled board via an unutilized part of panel to a testpad connector allowing all the board to be tested in one time before being separated at no extra cost. This operation drastically reduced the manual operation for testing of each board.
For a military application, we had to place & root a complex board with high level of integration. It involved 3 circular boards on flex-rigid technology bent one over the other. To reach the goal, each footprint was reduced to the minimum by working very closely with the board manufacturer.
For a railway application, the challenge was to be able to drive a high current with a printed board to lower integration cost. We designed a specific board with a 400µm copper layer on top to have enough section for that. Innovation in progress.