EMS
OVERVIEW & CAPABILITIES
World class manufacturing services hinge on state of the art facilities and a truly competent professional team. Centum manufacturing facilities are located in Bangalore, with a total of 350,000 sq. ft of production area. Over the years, we have developed and invested in many new processes and capabilities to meet the most complex and critical requirements of our customer.
At Centum, we have automated IT tools and technologies to manage the complete shop floor system with product traceability back to each phase of the manufacturing process. We provide a full range of test solutions be it to board level or complete system. We identify and implement the most suitable test strategy to deliver a fully working, quality product. We execute tests at several points in the electronics hardware manufacturing flow such as In-Circuit, Boundary scan, JTAG & continuity tests. A dedicated team is capable of developing fully Automated Test Equipment (ATE) based on modular & general purpose equipment for testing the complete functionality of a fully assembled product.
Fuji-Nxt – Multiple SMT Lines including both Single and Double Sided | Selective Wave |
IPC 610 Class 2 & 3 Assembly | Quartz Crystal Processing |
Clean & No-Clean Process | Thick / Thin Film Microelectronics |
PBGA (PITCH BALL GRID ARRAY) and FBGA (FINE BALL GRADE ARRAY) to 0.5mm | High Melting Point Solder |
Chip-on-Board / Wire Bond / Chip on chip | HMLV (high-mix low-medium-volume) PCB Assembly |
Through Hole & SMT Mixed | Complete end product assembly |
Through Hole to SMT Conversion | Avionics LRU assembly |
Leadless Chip | Overflow Assembly |
Fine Pitch (0201 & 01005) | Box Build / Final Assembly / System Integration |
Multi-Chip Modules | In-Circuit & Functional Testing |
Conformal Coating- Automated and manual | BGA Rework |
Automated cleaning solutions | Hotplate soldering |
Potting | Track cutting & Additive pad fixing |
Hot Plate Soldering | Flex Rigid PCB Assembly & Test |
RF & Microwave – Assembly & Test |
In circuit Test – HP & Teradyne | BGA Rework Stations |
Flying Probe Tester (Takaya) | Environmental Stress & Screening (ESS) – Active & Passive |
2D&3D Automatic XRAY Inspection | Functional Test Design, Development, Management |
Automatic Optical Inspection | Diagnostic Test |
Automatic Solder paste inspection | Firmware & System Test |
Synod & DITMICO cable test | Calibration |
Multiple JTAG test systems | NI & Key sight ATE |
Boundary Scan | Reverse engineering |
High Voltage & Insulation Testing |
He / FC Bombing | Liquid Thermal Shock |
Internal / External Visual Inspection | Thermal Humidity Bias Test |
Fine & Gross Leak Testers | Burn in Chambers |
Temperature Cycling (-65 to 200 deg C) | 3.5 Ton Vibration |
Constant Acceleration | Thermal Vacuum Chamber |