EMS
MICROELECTRONICS
Centum is India’s largest Microelectronics Design and Manufacturing Company with more than 15 years of credible deliveries to Telecom, Industrial, Defense and Space markets. The manufacturing is carried out on the state-of-the-art facilities in Class-10K clean rooms with critical processes done in Class-100 LFTs.
DESIGN CAPABILITIES:
- Design of Chip and Wire Microelectronics as per MIL-PRF-38534 guidelines.
- Microelectronics Designs for Analog, Digital and Mixed Signal Circuits.
- Low and High Frequency Microelectronics.
- Design of high Power Microelectronics using Alumina, Beryllia and Aluminum Nitride.
- Special techniques for handling high currents.
- Multilayer Microelectronics.
PROCESS CAPABILITIES:
| Process / Stage / Part /Material | Manufacturing Capabilities |
|---|---|
| Ceramic Substrate | Alumina (96%), Beryllia (BeO), Aluminum Nitride (AIN) 10, 15, 20, 25, 40, 50 mil thick |
| Printing | 6mil line and 6 mil gap |
| 6mil line and 6 mil gap | 10 conductor layers |
| Thick Film Pastes | Conductor: Au, Ag, PtAg, PdAg, PtPdAg Resistor Dielectric, Overglaze, Protective Coating |
| Die size | Solder attach, conductive / non-conductive epoxy attach |
| Die attach | Solder attach, conductive / non-conductive epoxy attach |
| Wire bonds | Au (0.7-2mil), Al (0.7,1, 2, 8, 10, 15, 20) Au ribbon |
| Hermetic Sealing | Seam sealing, Resistance welding, Laser welding |
| Passive Components | Large size tantalum cap attachment |
| MLCC | |
| Glob top | Dam and fill |
| Coil attachment | Solder attach, lead frame attach |
| Packages | Metallic (Bath tub and Butterfly) and Ceramic Special packages with Molybase and Kovar ring frame TO-3, 8 pin packages |